Halogen-free lead solder SF-N series Industry standard composition
Reduce the burden on the environment and the human body.
The reliability of the residue after soldering is excellent, and no-cleaning can be achieved. There are no intentional halogen components present. SF-N Series Common Items Composition: Sn-Ag-Cu 96.5-3.0-0.5% Melting Point: 217-220℃ Wire Diameter: Φ0.6, Φ0.8, Φ1.0mm Price: Open price
- Company:太洋電機産業
- Price:Other